AM3 MOTERBAORD RD890+SB800
AMD's chipset roadmap has been updated by a new slide that emerged today on the Web. According to it, the company will delay the RD890, RS880 motherboards with SB800 chipset, as well as themainstream AMD 760G IGP. It looks like the Sunnyvale chip manufacturer will add DDR3 support to its 790 FX and SB750, and it also plans to relaunch the chips at the beginning of 2009. The AMD 760G IGP mainstream chipset was originally slated for a Q4 2008 release.The existing high-end duo of 790 FX and SB750 supports AM3 sockets and Advanced Micro Devices plans to relaunch them in the first half of the next year, by the time its AM3 chips should also appear. It is worth noticing that 790 FX comes with support for HyperTransport 3.1 links, which can offer interconnect bandwidths of up to 6400 MT/s to the processor.
The RD890, RS880 will come along with SB800 chipset and DDR3, and are said to be the first platforms with AM3 compliance. The AM3 socket will allow AMD processors to access DDR3 memory. The new processor will have to feature DDR3 integrated memory controllers (IMC). Due to the delay, the AM3 chipsets will not be available by the time the company is expected to launch its next-generation CPUs. The new slide can be seen here.
Although the competition with Intel has pushed AMD a little backwards, the past few months showed that the company is ready to return to the battlefield. We should see some new additions on the processors side, especially because the chip manufacturer announced that it would make the transition to the 45nm fabrication process by the end of this year. The Deneb processor is said to come next year with a lot of performance improvements over the current generation, and the company also revealed it plans to launch a new mobile processor to compete with Intel's Atom AMD' s在網今天湧現的一張新的幻燈片更新了芯片組路線圖。 根據它，公司將延遲RD890， RS880與SB800芯片組的主板，並且主流AMD 760G IGP。 它看起来象Sunnyvale芯片制造者將增加DDR3支持到它的790 FX和SB750，并且它也計劃2009年年初重新開辦芯片。 AMD 760G IGP主流芯片組最初被提名為Q4 2008發行。 當它的AM3芯片應該也出现的時候，在下一年上半， 790 FX和SB750現有的高端二重奏支持AM3插口和先進的微設備計劃重新開辦他們。 它值得注意790 FX來有支持HyperTransport 3.1鏈接，可能為處理器提供互聯帶寬6400 MT/s。 RD890， RS880與SB800芯片組和DDR3一起將來，并且被認為與AM3服從的第一個平臺。 AM3插口將允许AMD加工者訪問DDR3記憶。 新的處理器將必須以DDR3集成記憶控制器為特色(IMC)。 當公司预计發射它的下一代CPUs的時候，由于延遲， AM3 chipsets不會是可利用的。 新的幻燈片能看這裡。 雖然與英特爾的競爭推后了的AMD少許，過去幾個月表示，公司准备返回到戰場。 我們應該看到在處理器邊的一些新的加法，特别是因為芯片制造者宣佈它今年底以前將做與45nm製造過程的轉折。 Deneb處理器說明年來與在當前世代的很多表現改善，并且公司也顯露了它計劃發射一個新的流動處理器與Intel'競爭; s原子
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AMD 760G IGP難道性能比780G差嗎?
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