Heatpipes to make an appearance in memory design this year|
OCZ Technology today announced its newest memory designs behind closed doors. The design, currently codenamed Flexpipe, will make an appearance on high-end OCZ XTC as early as February 2007.
The design of the Flexpipe heatsink revolves around a heatpipe that transfers heat from the module to another heatsink one centimeter above the memory bank. Air can pass freely under and over the heatsink bank -- an approach that allows air to move over the heatsinks of multiple modules when installed on a motherboard.
The new memory design just finished its pre-production trials and the company will move into test trial phases this month.
OCZ recently announced its hybrid FlexXLC heatsink, a design that can work as a watercooled or aircooled sink. OCZ Technology Vice President of Marketing and Communications, Alex Mei, claims "the Flexpipe is mainly designed for a memory platform above the OCZ XTC series memory, but will be priced more aggressively than FlexXLC modules."
Most likely, Flexpipe devices will go head-to-head against Corsair's wildly popular DOMINATOR series memory introduced in mid-2006.